Evonik Unveils “Debonding on Demand” for Easier Recycling

Evonik has introduced an innovative "Debonding on Demand" technology aimed at enhancing the sustainability of adhesives in modern manufacturing. This advancement facilitates easier disassembly and recycling of bonded components, addressing challenges associated with traditional adhesives in repair and recycling processes.

Developed collaboratively by Evonik's strategic innovation unit, Creavis, and experts from the Comfort & Insulation business line, this technology utilizes reversible or cleavable covalent bonds within the adhesive's chemical network. This design allows for significant cohesive strength loss after heat treatment, enabling efficient debonding. The approach is compatible with existing adhesive technologies, including polyurethanes, and offers a flexible range of debonding temperatures (80-150°C) suitable for both one-component (1K) and two-component (2K) adhesive systems.

“Despite the growing demand for debondable adhesives, to date there have been limited effective solutions available in the market to make disassembling material parts easier, said Dr. Nicolai Kolb, Manager Business Development at Creavis. “Evonik is committed to leading the way in adhesive innovation and our new approach is a positive step forward in developing more sustainable adhesive solutions that align with the principles of the circular economy.”

This "Debonding on Demand" concept is poised to transform the circular economy by simplifying the disassembly and recycling of products, thereby promoting more sustainable manufacturing practices.

Source: Evonik